He loea ʻo ShenGong Carbide Knives (SG) i nā pahi ʻokiʻoki tungsten carbide paʻakikī kiʻekiʻe i hoʻolālā ʻia no nā noi ʻokiʻoki foil koʻikoʻi. Me ka >3500 MPa (ikaika haki transverse) a me ka pololei o ka ʻaoʻao micron, hoʻopau kā mākou mau pahi ʻokiʻoki foil alumini i ka lepo, nā burrs, a me nā kīnā lihi—kūpono no nā foils electrode pākahiko (Li-ion/NiMH), ka hoʻopili palupalu, a me nā mea hui hou.
No ke aha he pahi ʻokiʻoki a SG?
ʻOki ʻana i ka ʻole o ka Burr: Hoʻomaopopo ka ʻenehana wili liʻiliʻi i nā ʻoki maʻemaʻe ma ka pepa keleawe 3.5μm a me ka pepa alumini 15μm.
Uhi PVD: 3–5X ʻoi aku ka lōʻihi o ke ola ma mua o nā pahi i uhi ʻole ʻia. Kūʻē i ka ʻaʻahu, ka pipili, a me ka pala.
Nā Hoʻonā Pilikino: Hoʻololi i ka laulā o ka pahi, ke kihi o ka lihi, a i ʻole ka uhi ʻana e kāohi i nā lihi nalu a me nā kīnā e pili ana i ka haunaele.
Kākoʻo ISO 9001 & OEM: Hilinaʻi ʻia e nā mea hoʻolako foil pila honua a me nā mea hana mīkini slitting.
Mea Paʻakikī Loa: ʻO ka tungsten carbide i hoʻopaʻa ʻia me ka paʻakikī HRC 90+.
Hana ʻia no nā Pepa Kini Lahilahi: Hoʻohana i ka pepa kini keleawe 3.5–5μm, ka pepa kini alumini 15μm, a me nā mea hui multi-layer.
Hoʻolālā Anti-Defect: Hoʻemi ka poli ʻia (kaʻe o ke kāʻei) i nā micro-māwae a me ka delamination.
Ikaika Alakaʻi ʻOihana: >3500 MPa e pale ai i ka chipping ma lalo o ka slitting wikiwiki kiʻekiʻe.
Nā Koho Uhi PVD/DLC: TiAlN, CrN, a i ʻole ke kalapona e like me ke daimana (DLC) no ka lōʻihi loa.
| Nā Mea | øD*ød*T mm |
| 1 | Φ50*Φ20*0.3 |
| 2 | Φ80*Φ20*0.5 |
| 3 | Φ80*Φ30*0.3 |
| 4 | Φ80*Φ30*0.5 |
ʻOi aku ka maikaʻi o nā pahi ʻokiʻoki carbide a SG i nā hana ʻoki koʻikoʻi no nā mea holomua. Hāʻawi lākou i ka hana kīnā ʻole ma nā foil keleawe anode ultra-thin (3.5-8μm) a me nā foil alumini cathode (10-15μm) no nā pila lithium-ion/NiMH. Hilinaʻi nā mea hoʻolako mea pila i kā mākou mau pahi no nā foil i ʻōwili ʻia me ka maʻemaʻe kiʻekiʻe, e hōʻoiaʻiʻo ana i nā lihi ʻaʻohe haumia. Hoʻohui nā mea hana mīkini ʻokiʻoki i kā mākou mau pahi laulā maʻamau no nā lako hoʻololi foil pololei. Hana pū nā pahi i nā kiʻiʻoniʻoni pale EMI maʻemaʻe a me nā substrates PCB maʻalahi me ka ʻole o nā microtears. Me nā lihi i uhi ʻia e PVD, lawelawe lākou i nā foil composite i ka ikehu hou a me ka hoʻopili uila - ʻoi aku ka maikaʻi o nā mea hana maʻamau i ka maikaʻi o ka lihi a me ka lōʻihi.
Q: Pehea e hoʻomaikaʻi ai ka pahi a SG i ka hua o ka pepa kini pila?
A: Hoʻemi kā mākou kaohi lihi pae micron i ka haehae ʻana o ka foil a me ka hana lepo, he mea nui ia no ka hana ʻana i ka pila wikiwiki.
Q: Hiki iā ʻoe ke hoʻohālikelike i nā ana o ka pahi e kū nei?
ʻAe! E hāʻawi mai i kou laulā, OD, ID, a i ʻole ke kihi o ka lihi—hāʻawi mākou i nā pahi ʻokiʻoki kūpono loa.
Q: He aha ka uhi ʻoi aku ka maikaʻi no ka ʻoki ʻana i nā foil composite?
A: Manaʻo ʻia ka uhi ʻana o DLC no nā pepa alumini i uhi ʻia i ke kalapona ma muli o kona mau waiwai ʻaʻole e pipili.