I-ShenGong Carbide Knives (SG) igxininise kakhulu kwi-tungsten carbide slitting blades eyilelwe kwii-foil-cutting applications ezibalulekileyo. Nge> 3500 MPa (amandla e-transverse rupture) kunye ne-micron-level edge precision, i-aluminium foil slitter blades yethu isusa uthuli, i-burrs, kunye ne-edge defects-ephelele kwiifayili ze-electrode zebhetri (i-Li-ion / NiMH), ukupakishwa okuguquguqukayo, kunye nezinto ezintsha ezidibeneyo.
Kutheni ii-SG's Slitting Knives?
I-Zero Burr Cutting: I-teknoloji yokugaya i-Micro-grinding iqinisekisa ukusika okucocekileyo kwi-3.5μm ye-copper foil kunye ne-15μm ye-aluminium foil.
I-PVD Coating: 3–5X ubude bobomi obude vs. iincakuba ezingagqunywanga. Ixhathisa ukunxiba, ukuncamathela, kunye nokudleka.
Izisombululo zesiko: Guqula ububanzi be-blade, i-edge angle, okanye i-coating ukuze ucinezele i-wavy edges kunye neziphene ezinxulumene noxinzelelo.
I-ISO 9001 kunye neNkxaso ye-OEM: Uthenjwa ngababoneleli befoil yebhetri yehlabathi kunye nabavelisi bomatshini wokusika.
I-Ultra-Hard Material: I-tungsten carbide enesamente ene-HRC 90+ yobunzima.
I-Engineered for Thin Foils: Iphatha i-3.5-5μm ye-copper foil, i-15μm i-aluminium foil, kunye ne-multi-layer composite.
I-Anti-Defect Design: Icwecwe (ibhendi yomphetho) inciphisa i-micro-cracks & delamination.
Amandla aKhokela kwiShishini:> 3500 MPa inqanda ukutshitshwa phantsi kwesantya esiphezulu.
I-PVD / DLC Izinketho zokugubungela: i-TiAlN, i-CrN, okanye i-diamond-like carbon (DLC) yokunyamezela ngokugqithiseleyo.
| Izinto | øD*ød*T mm |
| 1 | Φ50*Φ20*0.3 |
| 2 | Φ80*Φ20*0.5 |
| 3 | Φ80*Φ30*0.3 |
| 4 | Φ80*Φ30*0.5 |
Iimela zokusika ze-SG ze-carbide zigqwesa kwimisebenzi ebalulekileyo yokusika kwizinto eziphucukileyo. Bahambisa ukusebenza okungenasiphako kwi-ultra-thin anode copper foil (3.5-8μm) kunye ne-cathode aluminium foil (10-15μm) yeebhetri ze-lithium-ion / NiMH. Ababoneleli ngemathiriyeli yebhetri baxhomekeke kwiincakuba zethu zokucoceka okuphezulu kweefoyile eziqengqelekayo, ziqinisekisa imiphetho engenasulelo. Abavelisi boomatshini bokusika badibanisa iincakuba zethu ezibanzi ngokwesiko ukulungiselela izixhobo ezichanekileyo zokuguqula ifoyile. Iimela zikwavelisa iifilimu ezikhuselayo ze-EMI ezicocekileyo kunye ne-PCB substrates ngaphandle kwee-microtears. Ngemiphetho egqunywe nge-PVD, baphatha iifoyile ezihlanganisiweyo zamandla amatsha kunye nokupakishwa kwe-elektroniki - zihlala zigqithisa izixhobo ezisemgangathweni kumgangatho wecala kunye nobomi obude.
Umbuzo: Imela ye-SG iphucula njani isivuno sefoli yebhetri?
A: Ulawulo lwethu lomda we-micron-level lunciphisa ukukrazula kwefoyile kunye nokuveliswa kothuli, okubaluleke kakhulu kwimveliso yebhetri enesantya esiphezulu.
Umbuzo: Ngaba unokuthelekisa imilinganiselo ekhoyo yeblade?
A: Ewe! Nikeza ububanzi bakho, i-OD, i-ID, okanye i-edge edge-sihambisa iimela zokuqhawula ezihambelana ngokupheleleyo.
Umbuzo: Yeyiphi i-coating efanelekileyo yokusika iifoyile ezidibeneyo?
A: Ukugquma kwe-DLC kunconywa kwi-carbon-coated aluminium foil ngenxa yeempawu zayo ezingenazintambo.